Tuesday, 24 April 2012

Week 14

Title of Activity : Demo Final Year Project

Objective : To present the Final Year Project to the assessors and demo the functionality and creativity of project.

Content/ Procedure :

1) I set up the table and preparing the information that I will present to the assessors and the questions that will they ask to me.

2) The marks that will give to me basically on poster, presentation with explanation on methodology, objectives and result also demo of project with innovation and creativity project.

3)After finish the demo, the exhibition end.

Result and analysis :

I lastly success in presenting the project with smoothly. Although, tired but I'm happy with the presentation that I have done today.

Conclusions :

From the presentation day that I have done, will improve my soft skills and also creativity in building the project. When I work later on, I can used this skill in my field of engineering.


Monday, 16 April 2012

Week 13

Title of Activity : Making Brochure for Final Year Project Demo

Objective : To detailing the Final Year Project as a references to the visitor as a good informations.

Content/ Procedure :

1) I design the brochure in the Microsoft Office Publisher Document.

2) I print out the brochure for many handouts of copy.
 
Result and analysis :




Conclusions :

With this design of brochure, can give a good impressions of people to my project and will attract with the information and design that I have done. I hope my Final Year Project Presentation will done successfully and smooth.


Tuesday, 10 April 2012

Week 12

Title of Activity : Preparing Poster for Final Year Project Demo

Objective :To give brief informations about the project as a delivering method to the viewer.

Content/ Procedure :
1) I design the poster using Microsoft Office Power Point.

2) In the poster, objective, methodology and result are the the main points that must be included in the poster.

3) I choose the suitable background that will attract visitors to come to my booth.

4) I print the poster at the shop around Gombak area.

Result and analysis :


Conclusions :

I successfully design the good poster when come Final Year Project Presentation. I hope with this attractive poster can attract the visitor to come to my booth later. With my brief explanation about the poster later on can convincing my assessors with my Final Year Project.


Wednesday, 4 April 2012

Week 11

Title of Activity : Preparing Video for Final Year Project Demo

Objective : To make the presentation of Final Year Project more interesting and attractive to the viewer when come to see the project and give information direct to the people.

Content/ Procedure :

1) Install Windows Movie Maker 2.6 that I download in the internet.

2) Then, I record the video of my project that I successfully completed to functioned and recorn in my phone.

3) Next, I uploaded it in the Movie Maker to edit the video and add some effects to make it more interesting
also not boring to watch.

4) Lastly, the video completed edit and now can view in the Windows Media Player to easy watch.

Result and analysis :

The video that I have done in Movie Maker




Conclusions :

I have completed in doing my video and success doing my project to honoured Bachelor of Engineering  Technology in Medical Electronics for S1'12. Thank you to all that help me in finishing my Final Year Project especially my supervisor, friends and family.



Tuesday, 27 March 2012

Week 10

Title of Activity : Studying the Program that will Used in the Project which are PIC C Compiler using CCS Programming.

Objective : To improve my skill in programming doing Final Year Project

Content/ Procedure :

1) I install the PIC C Compiler in my laptop for easy doing and testing my Final Year Project coding.



2) In my Final Year Project, I used C language which is CCS programming.

3) Then, I testing with my first coding which is display below


#include<16F877A.h>

#fuses HS,NOLVP,NOWDT
#use delay(clock=20000000)
#include<lcd.c>
void wait_for_one_press()
{  while(input(PIN_B0)) ;
   while(!input(PIN_B0)) ; //Wait for one press
}

void main()
{
   long reading;
   float red, green, blue, total;
   lcd_init();
   lcd_gotoxy(1,1);
   delay_ms(500);
   printf (lcd_putc,"COLOR SENSOR");
   while (true){
   wait_for_one_press();
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"SCANNING..");
   setup_adc_ports(RA0_ANALOG);                 //select adc port
   setup_adc(ADC_CLOCK_INTERNAL);               //set adc clock
   set_adc_channel(0);                          //select adc pin RA1
   output_high (PIN_B7);
   delay_ms(1000);
   reading = read_adc();
   red = reading;
   delay_ms(500);
   output_low (PIN_B7);
   output_high (PIN_B6);
   delay_ms(1000);
   reading = read_adc();
   green = reading;
   delay_ms(500);
  
   output_low (PIN_B6);
   output_high (PIN_B5);
   delay_ms(1000);
   reading = read_adc();
   blue = reading;
   delay_ms(500);
   output_low (PIN_B5);
   //delay_ms(200);
   total = red + green + blue;
   delay_ms(500);
  
   if (total < 728){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR WHITE");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
  
  
  
   else if(total == 736){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR BLUE");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
   else if(total == 737){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR BLUE");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
  
   else if(total == 735){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR GREEN");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
  
   else if(total == 734){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR RED");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
  
   else if(total == 733){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR RED");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
  
   else if(total >= 738){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR BLACK");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
  
   else{
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"ERROR");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
}
}
   
After I compiled, there is no error. Then I burned the program into PIC microcontroller to operate my project. Nice first try. I did it. But, the program is not accurate measurement and display the wrong colour. Furthermore, the range between another colours are so close. So, I must widen the range between another colours. Then, I try with another new coding.

#include<16F877A.h>
#device ADC=10
#fuses HS,NOLVP,NOWDT
#use delay(clock=20000000)
#include<lcd.c>

void wait_for_one_press()
{  while(input(PIN_B0)) ;
   while(!input(PIN_B0)) ; //Wait for one press
}

void main()
{
   long reading;
   float red, green, blue, total;
   lcd_init();
   lcd_gotoxy(1,1);
   delay_ms(500);
   printf (lcd_putc,"COLOR SENSOR");
   while (true){
   wait_for_one_press();
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"SCANNING..");
   setup_adc_ports(RA0_ANALOG);                 //select adc port
   setup_adc(ADC_CLOCK_INTERNAL);               //set adc clock
   set_adc_channel(0);                          //select adc pin RA1
   output_high (PIN_B7);
   delay_ms(1000);
   reading = read_adc();
   red = reading;
   delay_ms(500);
   output_low (PIN_B7);
   output_high (PIN_B6);
   delay_ms(1000);
   reading = read_adc();
   green = reading;
   delay_ms(500);
  
   output_low (PIN_B6);
   output_high (PIN_B5);
   delay_ms(1000);
   reading = read_adc();
   blue = reading;
   delay_ms(500);
   output_low (PIN_B5);
   //delay_ms(200);
   total = red + green + blue;
   delay_ms(500);
  
   if (total <= 2940){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR WHITE");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
  
  
  
   else if(total<=2970 && total>= 2963){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR BLUE");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }

   else if(total<=2949 && total>=2943){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR GREEN");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
   
   else if(total<=2958 && total>=2950){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR RED");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
  
  
   else if(total >= 2971){
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"COLOR BLACK");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
  
   else{
   lcd_init();
   delay_ms(500);
   lcd_gotoxy(1,1);
   printf (lcd_putc,"ERROR");
   lcd_gotoxy(1,2);
   printf (lcd_putc,"%f",total);
   delay_ms(1000);
   }
}
}
  
Lastly, I did the program and make the project functioned properly. The colour detector can accurately measure the five colours range without any errors. All the colour can display the results on the LCD screen correctly.

Result and analysis :
 
First coding :



Second coding :




Conclusions :

I feel very happy because I successfully can functioned the project although my first try. I copy the coding in the internet from forum chat in the internet that discussing about the coding in the PIC C Compiler. I also learned the programming from my knowledgeable friends and lecturer on how to edit and lastly burned the program in the PIC microcontroller.



Monday, 19 March 2012

Week 9

Title of Activity : Soldering process

Objective :
To develop the complete circuit and connected between another components on the PCB board to functioned it

Content/ Procedure :

Soldering is defined as the joining of metals by a fusion of alloys which have relatively low melting points. In other words, using a metal that has a low melting point to adhere the surfaces to be soldered together. Consider that soldering is more like gluing with molten metal, unlike welding where the base metals are actually melted and combined. Soldering is also a must have skill for all sorts of electrical and electronics work. It is also a skill that must be taught correctly and developed with practice.

Soldering Equipment

The Soldering Iron/Gun

Soldering iron is the heat source used to melt solder. Irons of the 15W to 30W range are good for most electronics/printed circuit board work. Anything higher in wattage and will risk damaging either the component or the board. If need in soldering heavy components and thick wire, then use an iron of higher wattage (40W and above) or one of the large soldering guns. The main difference between an iron and a gun is that an iron is pencil shaped and designed with a pinpoint heat source for precise work, while a gun is in a familiar gun shape with a large high wattage tip heated by flowing electrical current directly through it.



Prepared to solder


1) Tinning The Soldering Tip

Before used it, I tinned the solder. Tinning is the process of coating a soldering tip with a thin coat of solder. This aids in heat transfer between the tip and the component that I soldered, and also gives the solder a base from which to flow from.

2) Warm Up The Iron

I warmed up the soldering iron. I make sure that it has fully come to temperature because then I melt a lot of solder on it. This is important if the iron is new because it may have been packed with some kind of coating to prevent corrosion.

3) Prepared A Little Space

While the soldering iron is warming up, I prepared a little space to work. I moistened a little sponge and placed it in the base of my soldering iron stand or in a dish close by.

4) Thoroughly Coat The Tip In Solder



5) Clean The Soldering Tip



Soldering A Printed Circuit Board (PCB)

1) Surface Preparation

I cleaned the board down to shiny copper which is I use a solvent such as acetone to clean any bits of the cleaning pad that may remain and to remove chemical contamination from the surface of the board. Methyl hydrate is another good solvent and a bit less stinky then acetone. Be aware that both these solvents can remove ink, so if your board is silk screened, test the chemicals first before hosing down the entire board.  

2)  Component Placement

After the component and board have been cleaned, I placed the components onto the board. I start with the smallest and flattest components which are resistors, ICs, signal diodes, etc. and then work up to the larger components which are capacitors, power transistors, transformers after the small parts are done. This keeps the board relatively flat, making it more stable during soldering. It is also best to save sensitive components (MOSFETs, non-socketed ICs) until the end to lessen the chance of damaging them during assembly of the rest of the circuit.  

In the image below, a resistor soldered and held in place by slightly bent leads.



3) Apply Heat



4) Apply Solder To The Joint



Once the component lead and solder pad has heated up, I soldered. I started with touched the tip of the strand of solder to the component lead and solder pad, but not the tip of the iron. When everything is hot enough, I soldered freely around the lead and pad.

5) Inspect The Joint and Cleanup

Last but not least, I used a small set of side cutters and cut at the top of the solder joint to trim the lead.


Result and analysis :


Backview of PCB board after being soldered


The completed circuit after soldered



Conclusions :

This week, I have learned the correct ways in soldering the components on the PCB board. Practice make perfect. If we want the best result in soldering, we must doing the work neatly and have high focusing in complete the circuit's soldering.



Monday, 12 March 2012

Week 8


Title of Activity : Etching process

Objective : To develop the circuit on the PCB board

Content/ Procedure :

1)  
Firstly, one goal was to keep the circuit single sided so I etched using single sided PCB board. This will allow I to gain some experience before moving on to double-sided.

2)  
Here was a list of materials I need to produce a single-sided board.
Materials: A dedicated CAD program or simple art package, an inkjet or laser printer, compatible transparency film sheets, a UV exposure box, pre-sensitized copper clad board, optional: tin-plating crystals

For developing the board:
Materials: Sodium Hydroxide (Caustic Soda crystals), water, cold, a pair of plastic tweezers (for getting the the board out of the chemicals without using your fingers)

For etching the board:
Materials: Ferric chloride (crystals or ready made solution), water – hot, but not boiling, a small tray, slightly bigger than PCB is ideal

For drilling:
Materials: Ideally, a bench-mounted vertical drilling machine of some sort, a drill bit of 0.75mm diameter for most holes (0.9mm for pin headers etc.)
 
 3)



I printed the bottom side layer on a piece of paper from a high quality magazine. I used one actual page from the magazine, the thicker and shinier the magazine paper the better, but I do not use the cover. I used a laser printer, not an inkjet. If the printer uses ink cartridges and not toner cartridges, it will not work.

4)

I drenched PCB layout with sunflower-seed oil. I removed superfluous oil carefully with tissue paper. The sunflower-seed oil is used to make the white part of the layout paper transparent for light.


                                   Drench layout with oil                            Greasy layout

PCB UV Exposure

I removed the protective plastic layer and peeled back from the photosensitive PCB. I placed on the toner side of the greased layout into the copper of the PCB. I carefully captured air-bubbles that gently pressed away from underneath the layout. The PCB with the layout is now covered with an appropriate sized windowpane and I placed it on a piece of plain polished tile or marble. The tile or marble absorbs the heat coming from the UV bulb, which is significant. Three to four minutes 300W bulb UV exposure from a distance of 30-40 cm will do the photo process. I removed the PCB when all procedures were finished.


  Place layout with toner side on copper of the PCB
 

   Cover PCB and layout with window-pane

 Exposure
 
5)
I developed the PCB with a 1% solution of sodium hydroxide NaOH. I did this solvent by adding 10 gram of sodium hydroxide pellets to 1 liter of water and mix it until everything was dissolved. I used a brush to speed up the developing and clean the PCB during the process if the PCB was still greasy due to the applied sunflower-seed oil. The developing process takes about 1 minute. The traces should become clear and the exposed photosensitive layer has dissolved.

6)  
I developed PCB with etched in a solution of ammonium persulfate, I added 1 liter of water and mix it until everything is dissolved. I dissolved ammonium peroxydisulfate into water. I heated it which is air-bubble circulated etching fluid tank available. At higher temperatures the etching performance decreases. The etching process is an exothermic reaction, it generates heat. Then, I cooled the etching tray. I minimize the amount of copper to etch by creating copper area in my PCB layout as much as possible. When the ammonium peroxydisulfate was dissolved it is a clear liquid. 



Rock the etching tray


 

The epoxy of the PCB becomes visible


 Finished

 7)  

 


I drilled all the holes for the through-hole parts using the correct size PCB drill bit and rotary tool. I drilled     large mounting holes with a normal drill. PCB drill bits are carbide and made to drill through fiber glass that would quickly dull standard bits. There are  a few very common sizes of bits and these are often sold in packs. I used  0.0260″ for IC holes and 0.0310″ for resistors and caps.
      
Result and analysis : 


PCB board before developed


PCB board after developed


PCB board after etching


 UV box for exposure


 Conclusions :  

In this week, I just study how to etch the circuit on the PCB board in the PCB lab using its materials to produce the completed circuit. Then, I know how to develop it with the supervision of technicians there. They gave me advise and guideline on how to build the printed circuit using the correct techniques. I hope with this knowledge, can help me in future when I work later.